Nuevo Microsoldadoras De Chips en China

Film to Film Die Sorter MDAX-DS380F

• Fabricante: Minder Hightech

MD-DDM08 die demounter

• Fabricante: Minder Hightech

MDAX-FC810 flip chip die bonder

1.high speed: Según los requisitos del proceso del cliente, lograr la velocidad más rápida de la industria | 2.placement accuracy: Según los requisitos del proceso del cliente, lograr la mayor precisión de la ind...

Manual Epoxy and Eutectic Die Bonder

MDDB-LA838 Die attach

• Fabricante: Minder Hightech

Automatic die sorter

• Fabricante: Minder Hightech

MD-JC360-D Syringe type die bonder

Dual head high speed Die Bonder

Production cycle: ≥40ms Speed depends on chip size and bracket size | Die placement accuracy: ±25um | Chip rotation: ±3° | Chip size: 3.5mi1×3.5mi1-80milx80mil | Chip maximum angle correction: ±180°(Optional） | M...

Manual Epoxy die bonder

Automatic die bonder manual upload and down load

Md-jc360: 8inch wafer die bonder manual upload and dowload. | Md-jc380: 12inch wafer die bonder manual upload and download

MD-BT104 multifunctional pull tester for IC die bond wire bond

High precision die bonder MD-1412

Automatic die bonder automatic upload and download