MDICP-5000F Fully automatic ICP etching machine en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- ▲alarm system
- Safety requirements for equipment.
- 1. limit vacuum
- Etching chamber 9.0×10-5Pa (Indoor humidity≤55%)
- 2. etching material
- Ⅲ、ⅤMaterial、Si 、SiO2,etc
- 3. etching rate
- ~ 1μ/min
- 4. etching uniformity
- ≤±5％(φ125mm range)
- 6. electrode size
- φ200mm
- 4.delivery
- About 100 working days
- Note
- The above does not include experimental gas, pressure reducing valve, circulating water machine and air compressor.
- Subcategoría
- Pvd cvd ald rie icp ebeam
- Subcategoría 2
- Pvd cvd ald rie icp ebeam
- ID de Anuncio
- 79211656
Descripción
MDICP-5000F Fully automatic ICP etching
machine
1．System overview
▲Executive summary
The equipment is a two
chamber vacuum system. One chamber is the injection sampling chamber and the
other is the etching chamber. A vacuum lock is installed between the injection
sampling chamber and the etching chamber, and the injection sampling is
transported by manipulator.
The
equipment is mainly composed of vacuum system, gas circuit system, electrical
system, control system, cooling system, film feeding and taking mechanism,
alarm system, etc.
▲Vacuum system
The system consists of a
molecular pump with a pumping speed of 600 L / S + an imported vacuum dry pump
with a pumping speed of L / s to pump the etching chamber to high vacuum. An
electric dynamic pressure regulating valve is installed between the molecular
pump and the etching chamber. The imported dry pump is the pre pumping pump of
the etching chamber and the front stage pump of the molecular pump. Use another