Inductive coupling plasma etching (icp) system en Cantón, Guangdong, China
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Especificaciones
- Condición
- nuevo
- Subcategoría
- Pvd cvd ald rie icp ebeam
- Subcategoría 2
- Pvd cvd ald rie icp ebeam
- ID de Anuncio
- 79211654
Descripción
Inductive coupling plasma etching (icp) system
Project configuration and machine structure diagram
Process result
Quartz / silicon / grating etching
Using BR mask to etch quartz or silicon materials, the grating array pattern has the thinnest line up to 300nm and the sidewall steepness of the pattern is close to > 89°, which can be applied to 3D display, micro optical devices, optoelectronic communication, etc
Compound / semiconductor etching
Accurate control of sample surface temperature can well control the etching morphology of GaN based, GaAs, InP and metal materials. lt is suitable for blue lED devices, lasers, optical communication and other applications.
Silicon-based material etching
it is suitable for etching silicon based materials such as Si, SiO2, and SiNx. lt can realize silicon line etching above 50nm and silicon deep hole etching below 100um