Axus Surface en Chandler, Arizona, USA

The Axus Surface wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/device wafers. The Surface, which is based on the IPEC 472 chassis, features automatic wafer handling and is capable of two-platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the Surface is ideally suited for material polishing applications that require repeatability with operational and processing flexibility. The Surface comes standard with a 4-pass pneumatic system for carrier control. Many membrane carrier options are available for the Surface making it a very versatile polishing tool for all types of substrates. This tool has a long list of options that are not offered with remanufactured tools such as;